Brief: Discover the Precision Ultra-Thin Diamond Wire, a cutting-edge tool for slicing silicon wafers in semiconductor and PV industries. With ultra-thin diameter and high precision, it ensures minimal material loss and superior surface quality. Perfect for advanced packaging and solar cell production.
Related Product Features:
Ultra-thin diameter (30-100 μm) minimizes kerf loss and increases wafer yield.
High precision cutting ensures uniform wafer thickness (100-200 μm) with superior surface quality.
Diamond abrasives (5-30 μm) provide exceptional hardness and wear resistance.
High tensile core (steel or tungsten) ensures durability and breakage resistance during high-speed cutting.
Faster cutting speeds (1.5-2.5 m/s) compared to slurry-based multi-wire sawing.
Reduces material waste with kerf loss as low as ~100 μm.
Eco-friendly solution eliminating slurry waste and lowering environmental impact.
FAQs:
What industries benefit from the Precision Ultra-Thin Diamond Wire?
The semiconductor and photovoltaic (PV) industries benefit the most, especially for slicing silicon wafers for ICs, MEMS, power devices, and solar panels.
How does the diamond wire reduce material waste?
The ultra-thin diameter (30-100 μm) and precision cutting reduce kerf loss to ~100 μm, significantly lowering silicon waste compared to traditional slurry saws.
What are the advantages of using diamond abrasives?
Diamond abrasives (5-30 μm) offer exceptional hardness and wear resistance, ensuring long-lasting performance and high-efficiency cutting.